寶德塑膠金屬零部件（深圳）有限公司Established in 1928
Boyd Corporation is US company located in South Conifornia , US with 77 years history.
Boyd Corporation has evolved as the clear market leader in custom fabricated solutions for the electronics, transportation, and industrial markets.
Supporting our belief that people are our most valuable resource, Boyd dedicates the most experienced team in the industry towards the development of custom fabricated solutions. Boyds primary objective is to competitively support your specific product needs in the areas of: environmental seals and gaskets, EMI/RFI shielding, acoustical & thermal insulation, cushioning & shock absorption, thermal management, and bonding systems.
Boyds product development assistance unifies the concepts of industrial design, engineering, and manufacturing to speed time-to-market and optimize production. To ensure a high probability of success, cross-functional teams are assembled from disciplines that include mechanical design, material specification, tool making, project engineering, quality, and production to meet customer specific challenges. With a staff that recognizes the cost and timesaving importance of developing manufacturable product, Boyd provides assistance to enhance customers product development processes from initial investigation through final production.
The compressed product development cycles of todays dynamic marketplace demand swift results. Boyd integrates immediate access to a wide variety of materials with the rapid prototyping techniques of laser and waterjet to accelerate the prototype process. Same day or next day samples are often achievable.
Boyd Shenzhen is a new set up subsidiary of Boyd Corporation as an important step of Boyd Corporation long term strategy planning. She will play a very important role in corporate future business expansion.
本公司系美國獨資企業，于1928在美國加州成立。是美國西部最大的定制彈性物料解決方案的制造商。目前公司共有五個工廠，分別位于加州的Modesto，Chino；俄勒岡州的Portland；佛羅里達的Gaffney及中國的深圳。深圳工廠位于寶安區龍華鎮，總占地面積為2750平方米。主要經營及設計、開發塑料合金、合成橡膠、電磁和射頻屏蔽、熱絕緣體，絕緣成型件、高效電介屏蔽、汽車減震部件、減震墊、防震腳、緩沖器、光薄膠膜和新型電子元器件。